Two component epoxy adhesive, sealant, coating and encapsulating system
- Exceptional chemical resistance to acids
- Room temperature curing
- High temperature resistant to +400°F
- High bond strength
- Smooth paste consistency
- 100% reactive
Master Bond EP21ARHTND is a two component epoxy resin system for high performance bonding, sealing and coating. It has a convenient 100 to 50 mix ratio by weight and is formulated to cure at ambient temperatures or more quickly at elevated temperatures. It has exceptional resistance to a wide array of chemicals, particularly to acids (a more detailed list appears below). It is especially noteworthy for its resistance to sulfuric and hydrochloric acids.
EP21ARHTND is 100% reactive and contains no solvents or diluents. It has very low linear shrinkage upon cure. Also, it has outstanding physical properties and electrical insulation values. EP21ARHTND can be used as an adhesive, sealant, coating, potting or encapsulating material. EP21ARHTND is especially useful for coating tanks and other vessels that may contain acids. It is serviceable over the wide temperature range of -60°F to +400°F. It adheres well to a wide variety of substrates including metals, glass, ceramics and many rubbers and plastics. EP21ARHTND is a smooth paste and is considered a non-drip type system. Parts A and B are amber. This epoxy compound is widely used in aerospace, electronic, electrical, chemical processing applications and in other applications where chemical resistance to acids is needed and a non-drip viscosity is helpful.
- Smooth paste; contains no solvents or diluents
- Versatile cure schedules; ambient temperature cures or fast elevated temperature cures
- High bonding strength to both similar and dissimilar substrates
- Wide temperature service capability from -60°F to +400°F
- Good electrical insulator. Low viscosity. Ideal for potting and encapsulation
- Outstanding chemical resistance, particularly to acids
EP21ARHTND is available is various sizes and units to accommodate customer's needs.