Master Bond Product Search

531 products match

EP21FLVSP Two Part Epoxy EP21FLVSP

Fast curing two component epoxy adhesive. Convenient one to one mix ratio weight or volume. Serviceable from -60°F to +250°F. Ability to cure at low temperature. Easy application.


Two component flame resistant epoxy. Contains no halogens. Generates very low smoke when exposed to a flame. Suitable for electronic potting and encapsulation. Good flow properties. Impressive electronic insulation and chemical resistance. Serviceable from -60°F to +300°F.

EP21FRNS-2 Two Component Epoxy System EP21FRNS-2

Potting, encapsulation, casting compound meets UV 94V-0 flame retardant specifications. Convenient one to one mix ratio by weight. Features a non-halogen filler. Superb flow properties. Outstanding electrical insulation characteristics. Exceptional durability. Low smoke generation. Serviceable from -51°C to +90°C.

EP21H Two Component, Optically Clear Epoxy EP21H

Two component optically clear epoxy system. Special cross linking profile that allows for exceptional light transmission in the 250-365 nm spectra Long pot life. Low viscosity. Excellent physical strength properties. Serviceable from -60°F to +250°F.

EP21HT Two Part Epoxy System EP21HT

Two component adhesive, sealant and coating. High mechanical strength properties. Volume resistivity of 1014 ohm-cm. Dielectric constant of 2.90. One to one mix ratio. Tensile lap shear when bonding aluminum to aluminum of 3,200 psi at 75°F. Superior chemical resistance. Serviceable from -60°F to +400°F. Cures readily at ambient temperature or faster at elevated temperatures. Meets FDA 175.105 requirements for indirect food applications.

EP21HT-LO Two Part Epoxy System EP21HT-LO

NASA low outgassing approved. Two component smooth flowing epoxy with convenient one to one mix ratio weight or volume. High bond strength. Excellent electrical insulation properties. Withstands 1,000 hours 85°C/85% RH.

EP21HTFG Two Component Epoxy System EP21HTFG

Two component room temperature curing epoxy adhesive, sealant, coating. Moderate viscosity. Forgiving one to one mix ratio weight or volume. Formidable bond strength. Can be used for indirect food contact applications as per FDA 175.105 specifications. Serviceable from -60°F to +400°F.

EP21HTND Two Component Epoxy Adhesive EP21HTND

Room temperature curing two component non-drip paste adhesive. Serviceable from -60°F to +400°F. Impressive bond strength. Gap filler. Forgiving one to one mix ratio. Meets FDA Section 175.105 for indirect food contact. Shore D hardnes >75.

EP21HV Two Part Epoxy EP21HV

High performance two component adhesive, sealant, encapsulant. Good flow characteristics. Minimal shrinkage upon cure. Superior bond strength to similar and dissimilar substrates. One to one mix ratio weight or volume. Serviceable from -60°F to +250°F.

EP21LP Black Two Part Epoxy EP21LP Black

Moderate viscosity. Allows the hardness to be altered by adjusting the mix ratio. Reliable electrical insulator. Dimensionally stable. High physical strength. Low shrinkage upon curing Serviceable from -60°F to +250°F. Black color.