Master Bond Product Search

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EP21HTFG Two Component Epoxy System EP21HTFG

Two component room temperature curing epoxy adhesive, sealant, coating. Moderate viscosity. Forgiving one to one mix ratio weight or volume. Formidable bond strength. Can be used for indirect food contact applications as per FDA 175.105 specifications. Serviceable from -60°F to +400°F.

EP21HTND Two Component Epoxy Adhesive EP21HTND

Room temperature curing two component non-drip paste adhesive. Serviceable from -60°F to +400°F. Impressive bond strength. Gap filler. Forgiving one to one mix ratio. Meets FDA Section 175.105 for indirect food contact. Shore D hardnes >75.

EP21HV Two Part Epoxy EP21HV

High performance two component adhesive, sealant, encapsulant. Good flow characteristics. Minimal shrinkage upon cure. Superior bond strength to similar and dissimilar substrates. One to one mix ratio weight or volume. Serviceable from -60°F to +250°F.

EP21LP Black Two Part Epoxy EP21LP Black

Moderate viscosity. Allows the hardness to be altered by adjusting the mix ratio. Reliable electrical insulator. Dimensionally stable. High physical strength. Low shrinkage upon curing Serviceable from -60°F to +250°F. Black color.

EP21LP Gray Two Component Epoxy EP21LP Gray

Room temperature curing two component epoxy adhesive, sealant, coating, encapsulant. Varying mix ratio can adjust hardness of cure. Superior electrical insulation properties. Superb dimensional stability. Chemical resistant. Serviceable from -60°F to +250°F. Gray color.

EP21LP Two Part Epoxy EP21LP

Two component clear epoxy system. One to one mix ratio by weight or volume. Flowable. High bond strength. Temperature range from -60°F to +250°F. Versatile cure schedule. Easy application.

EP21LSCL-1 Two Part Epoxy EP21LSCL-1

Superb optical clarity. Non-yellowing properties. Two component low viscosity epoxy resin system. Long working life. Excellent electrical insulator. Used for large volume potting applications. Serviceable from -60°F to +250°F.

EP21LSCL-2 Two Part Epoxy EP21LSCL-2

Superb optical clarity. Non-yellowing properties. Two component low viscosity epoxy resin system. Long working life. Excellent electrical insulator. Used for large volume potting applications. Serviceable from -60°F to +250°F.

EP21LV Two Component Low Viscosity Epoxy System EP21LV

Epoxy adhesive, sealant, coating resists acids, alkalis and many solvents. Low viscosity room temperature curing. Contains no solvents. Serviceable from -60°F to +300°F. Castable to thicknesses exceeding 2-3 inches. Excellent electrical insulator.

EP21LV-1 Two Part, Low Viscosity Epoxy EP21LV-1

Slightly toughened. High strength bonds. Cures readily at room temperature. Enhanced resistance to mechanical vibration and shock. Serviceable from -60°F to +250°F. Available premixed and frozen.

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