Two component, low viscosity epoxy compound
- Suitable for bonding, sealing, coating, encapsulation and casting
- Adjustable rigidity and flexibility by altering the mix ratio
- Conforms to FDA Chapter 1, Section 175.105 for indirect food applications
- Cures at room temperature
- Serviceable from -65°F to +250°F
Master Bond EP21LV is a two component, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulation and casting. It is formulated to cure readily at room temperature or more quickly at elevated temperatures. It has a very forgiving one to one mix ratio by weight or volume. In fact, EP21LV has the unusual characteristic of being able to adjust the properties of the cured system by altering the mix ratio. Adding more of Part A (e.g. a two to one mix ratio) gives a more rigid cure, for enhanced machinability. While adding more of Part B (e.g. a one to two mix ratio) gives a more forgiving cure, for greater impact resistance. EP21LV produces high strength, durable bonds which hold up well to thermal cycling and resists many chemicals including water, oils, fuels, acids, bases and salts. It is serviceable over the wide temperature range of -65°F to +250°F. It bonds well to a variety of substrates including metals, glass, ceramics, wood, rubbers and many plastics. Once cured, EP21LV is an outstanding electrical insulator. This, coupled with its low viscosity, makes it an excellent encapsulating and potting epoxy. It meets FDA requirements for indirect food contact. EP21LV contains no solvents or diluents. While the standard color of the cured material is amber-clear, a wide variety of additional color choices are also available.
EP21LV, along with EP30Med and EP42HT-2 were cited in a report titled "Implementation of Biomaterials for the Encapsulation of Sensors" by Dabbs, Holmes, Kesler and Schaefer at the University of Tennessee, Knoxville. For more information click here.
EP21LV is available is various sizes and units to accommodate customer's needs.