Expanded Product List
Master Bond Product Search
616 products match
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Supreme 121AO Thermally conductive, electrically insulative. Outstanding dimensional stability. Passes NASA low outgassing tests. Very long open time. Ideally suited for potting applications. Serviceable from -80°F to +550°F. Black in color. Requires oven curing. |
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Supreme 121AOMed Thermally conductive, electrically insulative. Outstanding dimensional stability. Passes ISO 10993-5 tests. Very long open time. Ideally suited for potting applications. Serviceable from -80°F to +550°F. Black in color. Requires oven curing. |
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Supreme 121AOND Thermally conductive, electrically insulative. Outstanding dimensional stability. Passes NASA low outgassing tests. Very long open time. Paste consistency. Ideally suited for potting applications. Serviceable from -80°F to +550°F. Black in color. Requires oven curing. |
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Supreme 12AOHT-LO One component, heat cure system for bonding, sealing. High strength product. Service operating temperature range from 4K to +500°F (260°C). Resists aggressive thermal cycling and shock. Substantial thermal conductivity of 9-10 BTU in/ft2 hr °F. Smooth thixotropic paste. NASA low outgassing approved. Meets MIL-STD-883J Section 3.5.2 for thermal stability. Withstands 1,000 hours 85°C/85% RH. |
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Supreme 17HT Master Bond Supreme 17HT is a one component toughened epoxy for bonding and sealing. It has a moderate viscosity system with good flow properties.The service temperature range is from -100°F to +550°F. |
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Supreme 17HTND-2 Master Bond Supreme 17HTND-2 is a one component toughened epoxy for bonding and sealing. It is a paste system with good physical strength properties.The service temperature range is from -100°F to +550°F. |
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Supreme 18TC single component epoxy adhesive features unmatched heat transfer properties. Capable of being applied in bond lines as thin as 10-15 microns. Low coefficient of thermal expansion. Meets NASA low outgassing specifications. Low shrinkage upon curing Operating temperature is 4k to +400°F. |
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Supreme 3 Storage stable one component heat curing epoxy adhesive. Versatile cure schedules. Electrically insulative. Durable system. Resists thermal cycling. Serviceable from -100°F to +250°F. |
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Supreme 30 Low viscosity, toughened, two component epoxy adhesives. High strength system. Superior durable. Adheres well to similar/dissimilar substrates. Serviceable from -60°F to +250°F. Exceptionally low shrinkage upon cure. Ambient temperature curing formulation. |
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Supreme 30AOHT Toughened, two component, thermally conductive/electrically insulative epoxy system. Bonding, sealing, casting compound. Resists chemical exposure and thermal cycling. 100% reactive. Low exotherm. High T-peel strength. Ambient temperature curing. Service temperature range -60°F to +250°F. |