Master Bond bonding, sealing, coating compounds are engaged in manufacturing wireless devices such as:
- Cellular and cordless phones
- Video game consoles
- Baby monitors
- Garage door openers
- Hands free headsets
- Personal computers
- Home security systems
- Fitness trackers
These communication contraptions require no cables or wires and employ different electromagnetic signals which are contingent on their wavelength/frequency. Different types of wireless communication exchange data without the use of electrical connectors over a wide range of distances through radio frequency, infrared, Wi-Fi, broadcast radio, blue tooth, light wave, microwave and mobile transmission. Other communication technologies of importance range from radar, satellite, cellular to global positioning systems. The type selected revolves around the type of device, range of data and the distances covered.
Wireless systems offer many advantages over wired systems. They allow increased mobility, simplicity, share files without having to be cabled, have a wider network reach, expanded scalability, not limited by a specific amount of connection ports, long life cycles and affordability.
Most noteworthy has been the development of special formulations by Master Bond for satellites. Through the use of our compositions, voice, video, data communication, have been highly successful in relaying signals to united widely separated areas on earth. These products are capable of withstanding a rocket launch and the most hostile space environments. These highly advanced systems have high temperature serviceability, resist vibration, impact, shock, cryogenic temperature, radiation and are certified to meet NASA low outgassing specifications. Communication satellites are currently in use by government, scientific, commercial organizations and have proven crucial for the military/defense industry, utility companies and during emergencies by first responders.
Available in a range of thicknesses, Master Bond grades are engineered for automated dispensing which speed productivity. Among the most popular compounds for wireless device assembly are structural adhesives, sealants to prevent passage of liquids/gases, liquid/film thermal conductive heat dissipative products, surface mount systems and liquid gasketing products. Other job proven liquid polymers include chip encapsulants, conformal coatings, low temperature curing silver filled electrically conductive adhesives and UV/visible light curing materials. Master Bond also compounds numerous dual cure formulas for "shadowed out" areas. Select systems are designed for adhering similar/dissimilar substrates exposed to thermal cycling.