Adhesive formulations for various hybrid microcircuit applicationsHybrid microcircuit is an electronic circuit, formed by attaching various semiconductor devices such as diodes and transistors, and passive devices such as resistors, capacitors, transformers, and inductors on a printed circuit board (PCB). They are used mainly in applications where low weight and high density are extremely important. Due to the weight and volume advantages over the regular printed wiring assemblies, they have been used extensively in space applications, as well as military, medical and automotive applications.

Master Bond offers a wide range of adhesives for use in Multichip Packaging applications. These products offer excellent adhesion to the substrates commonly used in Hybrid microcircuit applications such as ceramic, and both gold or nickel plated materials. Additionally, they offer excellent thermal cycling properties, superior electrical insulation properties coupled with high thermal conductivity and very high electrical conductivity for various connections in such applications. Low CTE, low shrinkage and low outgassing are some other properties of Master Bond epoxies being used in hybrid microcircuits.