Silver Conductive Epoxies for Smart Card ApplciationsSuccessful implementation of flip chip interconnections in smart card applications can be accomplished with Master Bond silver conductive adhesives. These products offer high reliability, cost effectiveness and easy, convenient dispensing. These systems feature resistance to:

  • High/low temperatures
  • Thermal cycling
  • Repeated bending
  • UV light
  • Humidity

Compounds have low volume resistivity and excellent bond strength to:

  • Polyesters
  • PVC
  • ABS
  • Polycarbonate

Our technology enable cards to be smaller and thinner. They are employed for:

  • Security
  • Authentication
  • Identification

Smart cards are used on a daily basis to meet the needs of consumers for:

  • Banking
  • Mobile communication
  • Healthcare
  • Public transportation