Removal of excess heat is essential for the long term performance and viability of electronic devices. As electronic modules and systems become miniaturized the use of thermally conductive adhesives, potting compounds, gels, films and preforms play an increasingly important role in preventing device failure. Degradation of temperature sensitive materials, metal migration and fatigue from expansion/contraction caused by thermal stresses can be prevented by proper design and selection of proper interface materials.
Technologically advanced formulations have been designed to meet the performance requirements of many high tech industries including:
For unique applications, special compounds were developed that offer:
- Flame resistance
- Gap filling
- Long pot life
- Superior bond strength properties
Master Bond thermally conductive/electrically insulative adhesive films and preforms have gained popularity and are more widely employed to meet thermal management specifications. They require no mixing, provide uniform bond line thicknesses and have limited squeeze out during bonding. Cure speeds are rapid at slightly elevated temperatures. They are easy to store and require no refrigeration or freezing. Films are available in a range of thicknesses (standard film thickness is 3 mils). Mechanical strength, thermal conductivity and electrical insulation is outstanding.