Flexible, Low Outgassing Epoxy Resin Compound Has High Thermal Conductivity

Master Bond Inc., Hackensack, N.J. has introduced a new high performance bonding, sealing, coating and encapsulation system called EP21TDC-2LO. This formulation offers high flexibility and excellent toughness. It cures at room temperatures or more rapidly at elevated temperatures. It has a 1 to 3 mix ratio by weight or volume and has a working life of >90 minutes for a 100gm. mass. EP21TDC-2LO is easy to apply. Little exotherm is developed during cure making it suitable for use in thick as well as in thin sectioned configurations.

Master Bond EP21TDC-2LO meets NASA low outgassing specifications. It exhibits outstanding electrical insulation properties and superior thermal conductivity. It is durable and adheres well to both similar and dissimilar substrates. EP21TDC-2LO has a service operating temperature range of 4K to 250°F. It also features exceptional thermal shock resistance.

EP21TDC-2LO has a Shore D hardness of 36 and an elongation of >50%. It has a tensile strength of 1,070 psi and a T-peel strength of >15 pli. Its tensile shear strength for aluminum to aluminum bonds is >980 psi. Particularly noteworthy is its volume resistivity of >10¹² ohm cm and its thermal conductivity of 9 BTU/in/ft²/hr/°F.

Master Bond EP21TDC-2LO is available for use in half-pint, pint, quart, gallon and 5 gallon container kits.

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