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EP21TCHT-1 Two Part Epoxy Adhesive EP21TCHT-1

Two part, room temperature curable epoxy system with high thermal conductivity. Serviceable from cryogenic temperatures up to +400°F. Electrically isolating. Meets NASA low outgassing specifications. Halogen free. Paste consistency. Formulated to cure at ambient temperatures. Withstands 1,000 hours 85°C/85% RH.

EP21TDC-2 Two Part Epoxy EP21TDC-2

Highly flexibilized. Serviceable from 4K to +250°F. Excellent peel strength. Superb thermal and electrical insulator. Good flow. Easy to apply. Low exotherm. Cures at ambient temperature. Variable hardness depending on cure schedule.

EP21TDC-2AN Two Part Epoxy EP21TDC-2AN

Flexibilized. Thermally conductive/electrically insulative. Thermal conductivity 22-24 BTU· in/ft2 hr· °

F. Serviceable from 4K to +250°F. Superb impact resistance. Long working life. High peel strength. Elongatio >25%.

EP21TDC-2AO Two Part Epoxy EP21TDC-2AO

Flexible high performance adhesive, sealant, encapsulant. Excellent heat dissipative properties. High dielectric strength. Long working life. Low exotherm. Elongatio >25%. Bonds well to similar and dissimilar substrates. Serviceable from 4k to +250°F.

EP21TDC-2AOLV Two Part Epoxy Compound EP21TDC-2AOLV

Flexible high performance adhesive, sealant, encapsulant. Excellent heat dissipative properties. High dielectric strength. Long working life. Low exotherm. Elongatio >25%. Low viscosity formulation bonds well to similar and dissimilar substrates. Serviceable from 4K to +250°F.

EP21TDC-2LO Two Part Epoxy EP21TDC-2LO

Highly flexibilized, thermally conductive/electrically insulative epoxy adhesive. High elongation. Exhibits superior shear and peel strength properties. Serviceable from 4K to 250°F. Withstands thermal cycling, thermal shock and mechanical shock. Passes NASA low outgassing test. Cures at room temperature or more quickly at elevated temperatures.

EP21TDC-2ND Two Part Epoxy EP21TDC-2ND

Two part highly flexible epoxy resin system. Smooth paste viscosity. Fills gaps. Excellent peel strength. Dependable resistance to thermal cycling.
Serviceable from 4K to +250°F. Formulated to cure at room temperature.

EP21TDCHT-LO Two Component Epoxy Adhesive EP21TDCHT-LO

Two component, toughened epoxy adhesive. High peel strength and shock resistant. NASA low outgassing certified. Convenient one to one mix ratio. Ideal for bonding similar and dissimilar substrates. Withstands 1,000 hours 85°C/85% RH. Serviceable from -100°F to +350°F. Good flow. Easy to apply.

EP21TDCNFL Two Component Epoxy EP21TDCNFL

Two component nickel conductive epoxy adhesive. High flexibility. Excellent peel strength. Service temperature range from 4K to +250°F. Low shrinkage upon cure. Resists a wide range of chemicals. Volume resistivity 5-10 ohm-cm. Convenient one to one mix ratio by weight or volume.

EP21TDCS Two Part Epoxy EP21TDCS

Two component, silver filled electrically conductive epoxy system with a convenient one to one mix ratio and very low volume resistivity. Cures at room temperature. Superior toughness. Serviceable from 4K to +275°F. Withstands rigorous thermal cycling. Successfully tested for 1,000 hours 85°C/85% RH. Exhibits superb thermal conductivity.

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