One component epoxy system for bonding, sealing and coating
- High temperature resistant
- Good dimensional stability
- Excellent physical strength profile
- Withstands 1,000 hours 85°C/85% RH
Master Bond EP11HT is a one component, heat curing, structural epoxy adhesive featuring high shear strength, easy handling and high temperature resistance. This one component system is formulated to cure at elevated temperatures, e.g. 90-120 minutes at 250°F or 60-90 minutes at 300°F. The minimum cure temperature is 250°F. EP11HT attains tensile strength in excess of 10,000 psi and forms rigid and dimensionally stable bonds. The service temperature range is -60°F to +450°F. As a one part system, it does not require mixing prior to use and has an unlimited working life at room temperature. EP11HT bonds well to a wide variety of substrates including metals, glass, ceramics and most plastics. It has excellent resistance to a wide range of chemicals including acids, bases, oils, salts and many solvents. A non-drip version called EP11HTND-2 is also available. Both systems are 100% reactive and do not contain any solvents or volatiles. The standard color is tan, but other colors are available. EP11HT can be used in aerospace, electronic, specialty OEM as well as R&D type applications, where high temperature resistance and robust physical strength properties are desirable.
- Single component system
- Excellent structural adhesive
- High tensile strength
- Wide service temperature range of -60°F to +450°F
EP11HT is available is various sizes and units to accommodate customer's needs.