Two component epoxy for potting, encapsulation, coating and sealing applications
- Low viscosity
- Electrically insulative
- Very long open time
- Compelling temperature resistance
- Impressive optical clarity
- Excellent physical strength profile
Master Bond EP121CL is a two component, high performance epoxy resin system that features very low viscosity and an extraordinary long open time at room temperature of at least 2-3 days. It does, however, require oven curing. The mix ratio is a relatively easy to use 100:80, by weight. A typical cure schedule is 2-3 hours at 250°F followed by 5-8 hours at 300°F with a 2 hour or longer post cure at 350°F, although, a number of variations are possible. It has excellent adhesion to a wide variety of substrates including metals, composites, glass, ceramics and many rubbers and plastics. EP121CL is particularly prominent for applications involving rigorous electrical insulation properties. Another attractive feature is its excellent physical strength profile. It offers superior chemical resistance to water, oils, acids, bases, fuels and many solvents. The service temperature range is -80°F to +500°F. EP121CL is a specialty type system that is used in a variety of aerospace, electronic and OEM type applications particularly for potting and encapsulation.
- Low viscosity
- Extraordinarily long open time
- Splendid thermal stability
- Marvelous electrical insulation properties
- First rate physical properties
- Great optical clarity
EP121CL is available is various sizes and units to accommodate customer's needs.