Two part, moderate viscosity, nanosilica filled epoxy system for bonding, sealing, coating and encapsulation
- Convenient mix ratio
- Exceptionally low shrinkage upon curing
- Outstanding dimensional stability
- Extraordinary electrical insulation properties
Master Bond EP21NS is a nanosilica filled epoxy system with a one to one mix ratio by weight. Upon mixing, it has moderate viscosity and good flow properties. It is formulated to cure at room temperature or more rapidly at elevated temperatures. The optimum cure is overnight at room temperature, followed by 4-5 hours at 150°F. This system is 100% reactive and does not contain any solvents or diluents. Because of the nanosilica filling it has exceptionally low shrinkage upon curing.
EP21NS bonds well to a wide variety of materials including metals, composites, glass, ceramics, rubbers and many plastics. It has excellent physical strength properties. EP21NS is highly resistant to water, oils, fuels, and salts. Using nanosilica resin gives this system enhanced dimensional stability and additional abrasion resistance. The electrical insulation profile is especially interesting, with a notable dielectric constant.
The service temperature range is -80°F to +250°F. Part A is translucent, Part B is amber. This system is recommended for use in the aerospace, electronic, optical, opto-electronic and specialty OEM applications where the property enhancements attributed to the nanosilica filler are essential.
- Convenient one to one mix ratio by weight
- Long working life
- Moderately high viscosity, flowable
- Noteworthy abrasion resistance
- Exceptional electrical properties at 16 GHz
EP21NS is available is various sizes and units to accommodate customer's needs.