- Convenient handling
- Good flexibility
- Well suited for EMI/RFI shielding
Master Bond EP21TDCNFL is a two component, nickel filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. It has a convenient 1:1 mix ratio by weight. It cures at room temperature in 48-72 hours, or more rapidly at elevated temperatures (3-4 hours at 150-175°F). The optimum cure schedule is overnight at room temperature followed by 2-3 hours at 150-175°F. It is 100% reactive and has very low shrinkage upon curing.
EP21TDCNFL bonds to a wide variety of substrates, including metals, composites, ceramics and many plastics. While most conductive epoxies tend to be rigid, this epoxy is specially formulated to have good toughness and flexibility. It can withstand thermal cycling as well as thermal and mechanical shocks. Its electrical conductivity is geared primarily for shielding applications. It is highly resistant to water, oils and fuels. The service temperature range extends from -100°F to 250°F. EP21TDCNFL will cure in sections up to 1/8 inch thick. The color of Parts A and B are dark gray. This system should be considered in applications where a more cost effective, less conductive alternative to silver is desirable.
- Convenient handling, one to one mix ratio by weight
- Easy to apply
- Versatile cure schedules
- Good electrical conductivity
Capable of withstanding rigorous thermal cycling
EP21TDCNFL is available is various sizes and units to accommodate customer's needs.