Two part, low viscosity epoxy for bonding, sealing, potting and filament winding featuring higher temperature resistance
- Very long working life
- Low exotherm
- Excellent physical strength properties
- Good optical clarity
Master Bond EP29LPHT is a two part, high performance epoxy system featuring low viscosity, exceptionally little exotherm, and a very long pot life after mixing. It has a forgiving two to one mix ratio by weight. The cure schedule is overnight at room temperature followed by 6 to 8 hours at 140-165°F. If possible, post curing for an additional 4 to 6 hours at 150-200°F will enhance the product’s properties. Heating at higher temperatures will allow the system to cure more rapidly. It does not contain any solvents or diluents. Upon curing, EP29LPHT has very low shrinkage and good dimensional stability.
EP29LPHT has good bond strength to a wide variety of substrates including metals, composites, glass, ceramics and many plastics. It holds up well to thermal cycling and shock. The system is a reliable electrical insulator and is thermally isolating as well. EP29LPHT resists water, oils, fuels, and a number of other laboratory chemicals. The service temperature range is -80°F to +350°F. Its long open time and low exotherm allow it to be used in large potting encapsulations as well as for filament winding. It should be considered a candidate for specialty applications in aerospace, electronic, optical, and fiber-optics, where this unusual property profile is desirable.
- Convenient, non-critical two to one mix ratio by weight
- Very low viscosity, exceptionally long working life
- Superior physical strength profile
- Reliable electrical insulator
- Optically clear
- Especially good adhesion to composites
EP29LPHT is available is various sizes and units to accommodate customer's needs.