Two component, low viscosity epoxy for bonding, sealing, coating and encapsulating

Key Features

  • Low coefficient of thermal expansion
  • Passes fungus resistance MIL-STD-810G
  • Withstands 1,000 hours 85°C/85% RH
  • Passes NASA low outgassing specifications

Product Description

Master Bond EP30LTE-LO is a specialty epoxy system featuring a low coefficient of thermal expansion (CTE), NASA low outgassing, and fungus resistance as per MIL-STD-810G. It can be used in bonding, coating, sealing and encapsulation applications. This lower viscosity system will cure at room temperature or more quickly at elevated temperatures. An optimum cure is overnight at room temperature, followed by a post cure of 4-8 hours at 150-200°F. EP30LTE-LO contains no solvents or diluents, has superior dimensional stability, and very low shrinkage upon curing.

EP30LTE-LO bonds well to a wide variety of substrates including metals, glass, ceramics and many rubbers and plastics. It is a good thermal conductor while retaining electric insulation properties. This system offers excellent resistance to many chemicals, such as water, fuels and oils, as well as a number of acids and bases. It is cryogenically serviceable with a temperature range of 4K to +250°F. Part A is off-white and Part B is clear. Master Bond EP30LTE-LO is especially used in aerospace, optical, electronic, specialty OEM and other applications where an ultra low CTE along with low outgassing is desirable.

Product Advantages

  • Low viscosity and good flow properties
  • Minimal shrinkage upon curing
  • Thermally conductive and electrically insulative
  • Fungal resistant
  • NASA low outgassing
  • Low coefficient of thermal expansion

Industrial Certifications

ASTM E595 Compliant

1,000 Hours at 85°C/85% RH

MIL-STD-810G for Fungus Resistance

Meets EU Directive 2015/863




Premixed & Frozen Syringe

EP30LTE-LO is available is various sizes and units to accommodate customer's needs.

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