Two component epoxy system for high performance applications
- For bonding, sealing and encapsulation
- Superior chemical resistance
- Curable at ambient or slightly elevated temperatures
- Low viscosity
Master Bond EP30M4LV is a two component, low viscosity epoxy system for high performance bonding, sealing and encapsulation. This system features a forgiving 100 to 60 mix ratio by weight. It can cure at ambient temperatures or more rapidly at elevated temperatures. However, to optimize the chemical resistance properties, it is recommended to add heat when curing. The optimum cure schedule is overnight at 75°F followed by 2-4 hours at 150-200°F. EP30M4LV resists water, acids, bases, fuels and oils, along with many strong solvents. Some of the potent chemicals it can resist include Skydrol, xylene, 70% sulfuric acid, 98% sulfuric acid, 50% sodium hydroxide and bleach. This system is 100% reactive and does not contain any solvents or other volatiles. EP30M4LV offers excellent adhesion to both similar and dissimilar substrates including metals, glass, ceramics and many plastics. It is also noteworthy for its superior electrical insulation properties. It has a low viscosity and excellent flow along with low exotherm. This enables it to be used for moderately sized potting and encapsulation applications. EP30M4LV is serviceable over the wide temperature range of -80°F to +250°F. The color of Part A is clear and Part B is amber. EP30M4LV can be used in the specialty OEM, oil and gas, chemical processing and electronic, among other industries, where this special profile of product properties is desirable.
- Non-critical mix ratio: 100 to 60 by weight
- Low viscosity, good flow; convenient for potting and encapsulation
- Outstanding electrical insulation properties
- High bond strength to a wide variety of substrates
EP30M4LV is available is various sizes and units to accommodate customer's needs.