Two component, room temperature curing epoxy for bonding and sealing
- Thick paste consistency
- Good machinability
- High temperature resistance
- Demonstrated radiation stability at high radiation dosages
- Withstands 1,000 hours 85°C/85% RH
Master Bond EP33ND is a two part, room temperature curing epoxy system used for bonding and sealing featuring high temperature resistance. It has superior dimensional stability and is easier to machine compared to other epoxies. It has a 100 to 70 mix ratio by weight and a very convenient one to one ratio by volume. This system cures readily at room temperature or more rapidly at elevated temperatures. To optimize its properties, the recommended cure schedule is overnight at room temperature followed by a post cure at 150-200°F for 2-3 hours. Once cured EP33ND has an exceptionally high temperature resistance, serviceable up to +450°F. It resists a range of chemicals including water, oils, fuels and many acids and bases. This thick non drip system bonds well to a wide variety of substrates including metal, glass, ceramics and many rubbers and plastics. It is a reliable electrical insulator. EP33ND is 100% reactive and does not contain any diluents or solvents. The color of Part A is gray, Part B is amber. It is widely used in aerospace, electronic, electrical and specialty OEM type applications.
- Convenient mixing: one to one ratio by volume
- High temperature resistance up to 450°F
- Excellent dimensional stability
- Easily machinable
- Radiation resistant
EP33ND is available is various sizes and units to accommodate customer's needs.