Two component, low viscosity, room temperature curing epoxy resin system
- Lower exotherm
- Withstands thermal cycling and shock
- Good chemical resistance
- Withstands 1,000 hours 85°C/85% RH
Master Bond EP39MHT is a two component, epoxy system for high performance bonding, sealing, coating, potting and encapsulation. The mix ratio is a forgiving one to one by weight. Upon mixing, this lower viscosity system has a relatively long working life. EP39MHT will cure at room temperature in 3-4 days. This can be accelerated by heat curing for 3-4 hours at 150-200°F. An optimum cure schedule would be overnight at room temperature followed by 2-4 hours at 150-200°F. EP39MHT has very low shrinkage upon curing.
This epoxy is an excellent adhesive and bonds well to a wide variety of substrates including metals, ceramics, composites and glass as well as many rubber and plastic materials. An interesting aspect of EP39MHT is its ability to withstand rigorous thermal cycling, vibration and shock. EP39MHT is a superior electrical insulation system. This, combined with its good flow properties and lower exotherm, allows it to be used for potting and encapsulation applications of relatively larger sizes. It has reasonably good chemical resistance to water, fuels and hydraulics as well as many acids and bases. The service temperature range is -100°F to +400°F. The color of Part A is clear and Part B is amber. EP39MHT might be used in aerospace, electronic, electrical, optical and specialty OEM applications where the product property profile described above is desirable.
- Easy to use, non-critical one to one mix ratio by weight
- Low viscosity, flows evenly and smoothly
- Versatile cure schedules; ambient temperature or elevated temperatures
- Excellent adhesion to many substrates
- Resists thermal cycling, vibration and shock
- Well suited for moderate to large encapsulation applications
EP39MHT is available is various sizes and units to accommodate customer's needs.