With its thin bond line thickness and low viscosity, EP4EN-80 is ideal for bonding, encapsulating and potting applications. Watch a real-life demonstration of how this epoxy compound can be used while observing its flowability and ease of use.
One component flowable epoxy for bonding and small encapsulation applications with a curing schedule at 80°C to 85°C
Key Features
- Thermally conductive, electrically insulating
- Ultra fine particle size
- Can cure up to 1/4 inch thick
- High modulus and compressive strength
Product Description
Master Bond EP4EN-80 is a one component, low viscosity epoxy mainly for potting applications. Curing is simple and straightforward, 90 minutes at 65°C plus 30 minutes at 80 to 85°C. The working life is 12-24 hours and any leftover material can be returned to the refrigerator for future use.
It has a thermally conductive, electrically insulative filler material with ultra small particle sizes. This imparts high mechanical strength properties, outstanding dimensional stability and low shrinkage upon curing.
EP4EN-80 is primarily for potting and encapsulation up to 1/4 inch thick. It is very low in viscosity and free flowing. Usually one part epoxies are too exothermic to be used in this fashion, but this system is specially formulated for lower heat generation.
EP4EN-80 bonds well to a variety of substrates such as metals, composites, ceramics and many plastics. It is electrically isolating and transfers heat very effectively. Also noteworthy is its high modulus and compressive strength. EP4EN-80 can also be used as an adhesive. Because the particles are so small it can be applied in thicknesses ranging from 10-15 microns. The combination of thin bond lines and thermal conductivity lowers the thermal resistance to 10-20 x 10-6 K•m2/W. This is a big positive in managing heat related issues. EP4EN-80 will resist waters, oils and fuels. Its color is gray. The service temperature range is -50°C to +150°C. The fact that this one part system with curing temperatures not exceeding 85°C, along with the other desirable properties mentioned above, offers an attractive option for small encapsulation applications in microelectronics.
Product Advantages
- Single component; no mixing needed
- Reusable when refrigerated
- Easy to manage curing schedule
- Highly useful potting epoxy
- Low thermal resistant adhesive
- Passes NASA low outgassing specifications
Industrial Certifications
ASTM E595 Compliant
Meets EU Directive 2015/863
Packaging
Can
Jar
Pail
EP4EN-80 is available is various sizes and units to accommodate customer's needs.
