One component, thermally conductive film for high performance bonding and sealing
- Convenient handling
- Good storage stability
- Uniform bond line thickness
- Passes NASA low outgassing
Master Bond FL901AO is a high performance thermally conductive, electrically insulating epoxy based film system. It has outstanding performance properties combined with easy handling and convenient storage stability. Its physical properties are particularly robust. It has excellent adhesion to metals, composites, glass, ceramics, and plastics. It has good chemical resistance to oils, water, etc. Curing is simple; that is oven curing for 1 hour at 250°F or 40-45 minutes at 300°F. It is highly resistant to thermal cycling and its service temperature range is -100°F to +400°F. Most importantly, it combines thermal conductivity with sterling electrical insulation properties. The standard size is 6” x 2” x 0.003”; although, other sheet sizes are available. It should be noted that special preforms can also be prepared. One of the main reasons for using this film is to obtain uniform bond line thicknesses. FL901AO can be used in a wide array of aerospace, electronic, electrical and specialty OEM applications where thermal conduction, electrical insulation and marvelous physical properties are desirable.
- No mixing required. Uniform bond line thicknesses
- Simple heat curing at 250-300°F
- Thermally conductive, electrically insulative
- Available in small sheets and preforms
- Highly functional die attach adhesive
FL901AO is available is various sizes and units to accommodate customer's needs.