One component, silver filled film for high performance bonding and sealing
- Convenient handling
- Good storage stability
- Excellent die attach adhesive
- Uniform bond line thickness
Master Bond FL901S is a silver filled epoxy based film system with outstanding performance properties, simple processing and very good storage stability. Unlike most electrically conductive film systems, FL901S does not require freezing, regular refrigeration is fine. It bonds well to a wide variety of substrates including metals, composites, glass, ceramics, and plastics. It can withstand aggressive thermal cycling as well as thermal and mechanical shocks. FL901S has good chemical resistance especially to oils, water, etc. Its cure is straightforward and to the point, 1 hour at 250°F or 40-45 minutes at 300°F. Its service temperature range is -100°F to +400°F. It is highly conductive with the volume resistivity less than 1 milliohmcm.
Master Bond FL901S is available in two standard sizes. The first is 6” long x 2” wide x 0.003“ thick. The second size with part number FL901S-R3 is 8” long x 4.6” wide x 0.003” thick. It should be noted that other sheet sizes are available, and more importantly, the film can be cut into special shapes and sizes called preforms.
One of the major advantages of this system is that it cures in a uniform bond line thickness. FL901S cures in a manner that ensures uniform bond line thicknesses. FL901S can be used in a wide array of electronic applications for bonding, sealing and coating. It has even been used for EMI/RFI shielding. In actuality, FL901S’ versatility enables it to be used in many specialty applications where easy processing, electrical conductivity and remarkable physical characteristics are desirable.
- Film system, no mixing required.
- Simple heat curing at 250-300°F
- Specialty preforms are available, i.e. films in special shapes and sizes
- Exemplary thermal cycling capabilities
- Superb die attach adhesive
FL901S is available is various sizes and units to accommodate customer's needs.