High Performance Epoxy Hot Melt With Excellent Adhesion To Metals, Wood and Other Substrates
High Performance Epoxy Hot Melt With Excellent Adhesion To Metals, Wood and Other Substrates
Master Bond Polymer System, MB525, is a high performance epoxy hot melt compound designed to provide excellent adhesion to metals, glass, wood and other substrates. It exhibits a comparatively low softening point of 190-220°F, low viscosity at 300°F and low peel values. Bond strength develops rapidly and is maintained over a wide temperature range (-25°F to +130°F). Recommended application temperature is 230°F to 260°F. for optimal results, surfaces to be bonded should be free of dirt, oil and grease.
