One component, high performance epoxy compound for bonding sealing and surface mount applications

Key Features

  • Convenient packaging and dispensing
  • Toughened system
  • Very fast curing
  • High bond strength

Product Description

Master Bond Supreme 3HTND-1SM is a one part, no mix system that combines easy processing, excellent physical and bonding strength properties, and the enhanced ability to resist thermal cycling for surface mount applications. This system requires oven curing at a minimum temperature of 250°F and will cure more quickly at 300-350°F. Therefore, its working life at room temperature is essentially unlimited. It is a smooth paste-like consistency that is ideal for surface mount usage, and when dispensed eliminates tailing. Also, it is available in a variety of colors although the standard is tan to brown. Additionally, it has excellent electrical insulation properties, good thermal conductivity and an enhanced ability to withstand thermal cycling and thermal and mechanical shocks. Supreme 3HTND-1SM is specially formulated to have exceptionally low ionic levels. The service temperature for this system is -100°F to +350°F. It is 100% reactive and does not contain any diluents or solvents. Although primarily intended for surface mount applications, it can be used in aerospace, specialty OEM and other electronic applications where an epoxy system with this dispensing profile is desirable.

Product Advantages

  • Single component system; no mixing required
  • Working life is “unlimited” at room temperature
  • Fast curing with versatile cure schedules
  • Excellent adhesive properties
  • Outstanding electrical insulator
  • Superior ability to withstand thermal cycling; thermal and mechanical shocks



Supreme 3HTND-1SM is available is various sizes and units to accommodate customer's needs.

Request Information