One component epoxy featuring non drip consistency for bonding, sealing and specialty dam-and-fill encapsulation

Key Features

  • Toughened system
  • Fast curing
  • Good physical strength properties
  • Convenient packaging and dispensing

Product Description

Master Bond Supreme 3HTND-2DM-1 is a rapid curing, toughened, one part epoxy. It can be used in numerous ways. These include various bonding and sealing applications especially where high strength and easy, fast processing are important. Another is for chip on board encapsulations. This refers to using the epoxy as a damming or blocking system. Specifically, it is intended to block the flow of still another epoxy that is encapsulating chips and wire bonds.

Supreme 3HTND-2DM-1 requires no mixing and cures readily at elevated temperatures. The minimum curing temperature schedule is 20-30 minutes at 250°F with an alternative being 5-10 minutes at 300°F. It is not premixed and frozen and its working life at room temperature is unlimited. It has a paste consistency making it well suited for bonding applications as well as for damming on circuit boards.

This epoxy bonds well to a wide variety of substrates including metals, composites, ceramics and many plastics. It provides excellent thermal conductivity while retaining superior electrical insulation values. It offers very good epoxy type chemical resistance to fuels, oils, water and cleaning agents. It has inherent toughness as well as the ability to withstand aggressive thermal cycling. The service temperature ranges from -100°F to +400°F. Its color is black but other options are available. Supreme 3HTND- 2DM-1 passes the NASA low outgassing test which allows it to be used in vacuum, aerospace, electro-optic and other related applications. Also, is has very low ionic levels of chlorine, sodium and potassiu < 10 ppm. These particular product attributes allow this epoxy to be used in aerospace, electro-optics, specialty OEM and related industries. Additionally, it fits nicely as a barrier material in electronic and semiconductor applications.

Product Advantages

  • Single component system; no mixing
  • Unlimited open time; rapid cure with heat
  • Versatile high strength adhesive
  • Reliable sealant
  • Ideal consistency for forming dams and barriers
  • Passes NASA low outgassing

Industrial Certifications

ASTM E595 Compliant

Meets EU Directive 2015/863



Supreme 3HTND-2DM-1 is available is various sizes and units to accommodate customer's needs.

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