The range of performance and processing requirements facing sensor designers and manufacturers is vast. Suitable adhesive systems are readily available to meet those demands. Using different fillers, manufacturers can create adhesive compounds that are optimized for specific combinations of performance characteristics like electrical or thermal conductivity, chemical resistance, and stability as well as processing characteristics like viscosity, work time and cure time. Learn more about the fundamental role that epoxy and silicone compounds play in diverse sensor devices.

 

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