Toughened, Two Component, Room Temperature Curing Epoxy System for Bonding, Coating, Sealing and Encapsulation Featuring Abrasion Resistance and Cryogenic Serviceability.
Two Component, Room Temperature Curing Epoxy Polysulfide for High Performance Bonding, Sealing, Coating and Encapsulation, Offers Excellent Toughness along with Superior Resistance to Chemicals, Particularly to Fuels and Oils.
One Component, High Viscosity LED Curable System for High Performance Bonding, Sealing, Coating and Encapsulation, Cures Tack-Free Without Any Oxygen Inhibition. Meets USP Class VI Specifications; Also Passes ISO 10993-5 Cytotoxicity Test.
Two Component, Very Low Viscosity, Room Temperature Curing Epoxy for Bonding, Sealing, Potting and Filament Winding with Exceptionally Low Exotherm and Long Working Life.
One Component, Low Viscosity UV Curable System for High Performance Bonding, Sealing & Coating, Featuring Excellent Physical Properties and Dimensional Stability.
