EP42HT-2ND-2 Product Information

Two Component, Room Temperature Curable, Epoxy Adhesive, Featuring High Temperature Resistance.

EP42HT-2FG Black Product Information

Two Component, Room Temperature Setting, Heat Resistant Epoxy System for Bonding, Sealing, Coating & Casting Specially Formulated for Indirect Food Applications.

EP35AOLV Product Information

Two Component Thermally Conductive Heat Resistant Epoxy Compound for High Performance Structural Bonding, and Casting

Clone of EP4UF-80 Product Description

EP4UF-80 One Component Epoxy

One component epoxy for bonding and underfill applications, minimum curing temperature 80°C

EP5TC-80 Product Description

EP5TC-80 One Component Paste Epoxy

One component epoxy for bonding, sealing and small encapsulation applications, curing temperature 80°C. Thermally conductive, electrically insulating, high compressive strength..

MasterSil 323 Product Information

Two Component, Addition Cured Silicone for bonding, sealing, and encapsulating. Featuring optical clarity and excellent strength properties.

EP41S-5Med Product Information

Two Part Epoxy EP41S-5Med

Two Component, Room Temperature Curable Epoxy Adhesive, Sealant, Coating and Encapsulating System, Featuring Outstanding Chemical Resistance to Solvents, Alcohols and Fuels.

EP4CL-80Med Product Description

One Part Epoxy EP4CL-80Med

One component, optically clear epoxy for bonding and sealing that cures at 80°C to 85°C. Ultra low viscosity. Meets ISO 10993-5

EP4CL-80 Product Description

One component, optically clear epoxy for bonding and sealing that cures at 80°C to 85°C. Ultra low viscosity. May be utilized for impregnation applications and spin coating.

EP62-1LPSPMed White Product Information

Two Part Epoxy EP62-1LPSPMed White

Two component, high performance epoxy system featuring biocompatibility for bonding, sealing, coating, encapsulating and impregnation

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