EP40ND Product Information

EP40ND Two Part Epoxy System

Two component, epoxy compound with a paste consistency, outstanding shear and peel strength for bonding, sealing and coating, featuring excellent adhesion to engineering plastics and metals, especially polycarbonates and acrylics

Supreme 42HT-2ND Black Product Information

Supreme 42HT-2ND Black Two Part Epoxy

Toughened, Two Component Epoxy Adhesive/Sealant Featuring High Temperature and Chemical Resistance; Superior Thermal Cycling Capabilities.

EP51FL-1ND-2 Product Information

EP51FL-1ND-2 Two Component Epoxy

Two component, epoxy resin system for high performance bonding, sealing and coating, featuring high flexibility, and a paste viscosity

UV17Med Product Information

One Component High Viscosity UV Curable System For Bonding, Sealing, Coating and Casting Featuring High Flexibility and Outstanding Abrasion Resistance

EP5LTE-100 Product Information

EP5LTE-100 is a flowable, one part epoxy with a low coefficient of thermal expansion

Flowable, one part epoxy with a low coefficient of thermal expansion. Cures at 100°C. Serviceable from -60°C to +175°C.

EP35AOLV Product Information

Two Component Thermally Conductive Heat Resistant Epoxy Compound for High Performance Structural Bonding, and Casting

EP21QF Product Description

EP21QF Two Component Epoxy

Two component epoxy adhesive, sealant, coating, and encapsulating system. Robust physical strength profile, good flow properties.

EP21AC Product Information

EP21AC Epoxy Potting Compound

UL94HB flame retardant, two component epoxy system. For encapsulating and coating that passes UL746A high amp arc ignition at 3.0 mm thickess with a PLC of 0. Convenient processing, 1:1 mix ratio by weight.

EP5TC-80 Product Description

EP5TC-80 One Component Paste Epoxy

One component epoxy for bonding, sealing and small encapsulation applications, curing temperature 80°C. Thermally conductive, electrically insulating, high compressive strength..

EP4G-80Med Product Description

One component epoxy for bonding, sealing and small encapsulation applications, curing temperature 80°C. Meets ISO 10993-5 for cytotoxicity. Graphite filled. Thermally conductive, electrically conductive, high compressive strength.

Pages