Adhesives, Sealants and Coatings for Computer ApplicationsAs the number of personal computers in the world grows into the billions, the manufacture, assembly and maintenance in this industry becomes increasingly vital. Master Bond is at the forefront of developing adhesive formulations that are technologically advanced for this booming industry. We have systems that are:

  • Thermally conductive/Electrically insulative
  • Water and chemical resistant
  • Withstand exposure to vibration, impact and shock
  • Durable
  • Dimensionally stable
  • Serviceable at high and low temperatures

Typical computer applications include:

  • Circuit board assembly
  • Semiconductor packaging
  • Heat sink attachment
  • Glob top coating
  • EMI/RFI shielding and gasketing
  • Potting/encapsulation

Special grades include NASA low outgassing approved and silver or nickel filled. We also have systems designed for underfill potting and flip chip assembly. Both one and two part systems are available and include epoxies, silicones, polyurethanes, polysulfides and UV curables.