Max invites you behind the screens of your electronic devices and ventures into the deep dark depths of flip chip underfills. He explains how specific compounds can fill tight spaces and to ruggedize components and improve their performance.
Hi. I’m Max, Master Bond’s representative for adhesives, sealants and coatings. I'd like to welcome you behind the screens of your electronic devices. Today, we will explore the deep dark depths of flip chip underfills. Let’s go!
In this electronic application the engineer must find a suitable epoxy compound to fill the gaps between the chip, solder balls, and circuit board. These tiny gaps actually look pretty big from where I stand! Master Bond offers many flowable systems which allow you to get into every nook and cranny of these crevices. For example, our latest product development EP62-1LPSP is an ultra low viscosity formulation so it can get deep into tight spaces. Additionally, it features a long working life at room temperature and it only requires moderate heat to cure. Basically, to extend the life of your electronic device, our adhesive successfully ruggedized the flip chip component from mechanical and thermal stresses.
Master Bond doesn’t just stop at underfills. We have formulations for potting, surface mount, die attach, conformal coating and so much more. So give us a call today! We’d love to hear about your electronic assembly application and help you meet your goals.