Featuring a combination of thermal conductivity and electrical insulation properties, Master Bond Supreme 3CCM-85 is a new single component epoxy
initially designed for glob top and chip coating applications.
However, this system can also be utilized for encapsulation and bonding. Supreme 3CCM-85 cures within 2-3 hours at 175-185°F [80-85°C],
Two component epoxy, Master Bond EP88FL, is a highly flexible, optically clear compound formulated for bonding, coating, sealing, potting and encapsulation.
It is easy to use, with a mixing ratio of one to one by weight or volume.
Master Bond Supreme 17HT is a single component, no mix epoxy system for bonding and sealing applications featuring an unlimited working life at room temperature. “This thermally stable formulation has a high glass transition temperature of 410°F (210°C) and retains its bond strength at elevated temperatures,” says Rohit Ramnath, senior product engineer.
Master Bond UV22DC80-1Med is a single component, nanosilica filled compound featuring a UV and heat curing mechanism.
Not only does it pass USP Class VI tests for biocompatibility, but it also meets ISO 10993-5 for cytotoxicity,
making it ideal for many applications in the medical device industry.
Master Bond EP30NG is a two part epoxy adhesive system developed for applications that require high thermal conductivity.
It contains a specialty graphene filler which contributes not only to its high compressive strength, but also to its enhanced dimensional stability.
Master Bond Supreme 3HTS-80 is a one part, silver filled epoxy adhesive that is not premixed and frozen and features an unlimited working life at room temperature.
“While typical heat activated epoxies require 250°F to 350°F to cure, Supreme 3HTS-80 cures at 175°F to 185°F within 2-3 hours” says Rohit Ramnath, Senior Product Engineer.