Expanded Product List
Master Bond Product Search
560 products match
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Supreme 121AOND Thermally conductive, electrically insulative. Outstanding dimensional stability. Passes NASA low outgassing tests. Very long open time. Paste consistency. Ideally suited for potting applications. Serviceable from -80°F to +550°F. Black in color. Requires oven curing. |
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Supreme 12AOHT-LO One component, heat cure system for bonding, sealing. High strength product. Service operating temperature range from 4K to +500°F (260°C). Resists aggressive thermal cycling and shock. Substantial thermal conductivity of 9-10 BTU in/ft2 hr °F. Smooth thixotropic paste. NASA low outgassing approved. Meets MIL-STD-883J Section 3.5.2 for thermal stability. Withstands 1,000 hours 85°C/85% RH. |
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Supreme 17HT Master Bond Supreme 17HT is a one component toughened epoxy for bonding and sealing. It has a moderate viscosity system with good flow properties.The service temperature range is from -100°F to +550°F. |
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Supreme 17HTMed Master Bond Supreme 17HTMed is a one component toughened epoxy for bonding and sealing that meets ISO 10993-5 for biocompatibility. It has a moderate viscosity system with good flow properties.The service temperature range is from -100°F to +550°F. |
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Supreme 17HTND-2 Master Bond Supreme 17HTND-2 is a one component toughened epoxy for bonding and sealing. It is a paste system with good physical strength properties.The service temperature range is from -100°F to +550°F. |
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Supreme 18TC single component epoxy adhesive features unmatched heat transfer properties. Capable of being applied in bond lines as thin as 10-15 microns. Low coefficient of thermal expansion. Meets NASA low outgassing specifications. Low shrinkage upon curing Operating temperature is 4k to +400°F. |
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Supreme 30 Low viscosity, toughened, two component epoxy adhesives. High strength system. Superior durable. Adheres well to similar/dissimilar substrates. Serviceable from -60°F to +250°F. Exceptionally low shrinkage upon cure. Ambient temperature curing formulation. |
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Supreme 30AOHT Toughened, two component, thermally conductive/electrically insulative epoxy system. Bonding, sealing, casting compound. Resists chemical exposure and thermal cycling. 100% reactive. Low exotherm. High T-peel strength. Ambient temperature curing. Service temperature range -60°F to +250°F. |
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Supreme 33 Thermally stable, toughened, two component epoxy adhesive, sealant, coating. Serviceable from -80°F to +425°F. Good strength retention at elevated temperatures. Superior durability. Withstands thermal cycling. Chemical resistant. Ambient temperature curing. One to one mix ratio by volume. |
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Supreme 33CLV Two component, room temperature curing structural epoxy system. Excellent bonding properties. Superior thermal cycling capabilities. Convenient one to one mix ratio by volume. Moderate viscosity. Toughened system. Outstanding resistance to water, fuels, various solvents acids and bases. Shore D hardness 75-80. |