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6 products match

EP17HTDA-1 One Part Epoxy EP17HTDA-1

Single component heat curable epoxy epoxy adhesive/sealant. Non-drip system. Resists up to 650°F. Meets NASA low outgassing specifications. Meets MIL-STD-883J Section 3.5.2 for thermal stability. High lap shear, tensile and compressive strength. Tg of 230-240°C after post cure.

EP21TDCHT Two Part Epoxy EP21TDCHT

High strength, high temperature resistant, two part system with excellent bond strength and thermal cycling capabilities. Serviceable from -100°F to +350°F. Meets MIL-STD-883J Section 3.5.2 for thermal stability. Moderate viscosity. Superior toughness. Withstands vibration, impact, shock. Good dimensional stability. Convenient one to one mix ratio. Dependable electrical insulation properties.

EP33

Meets MIL-STD-883J Section 3.5.2 for thermal stability. Room temperature curing system. One one mix ratio by volume. Superb chemical resistance and dimensional stability. Shore D hardness 85-90. Suitable for bonding, sealing, coating. Withstands 1,000 hours 85°C/85% RH. Serviceable from -60°F to +450°F. Easily machinable.

EP46HT-1AO Two Part Epoxy Compound EP46HT-1AO

Thermally conductive/electrically insulative heat resistant epoxy compound. Requires oven curing. Meets NASA low outgassing specifications. Meets MIL-STD-883J Section 3.5.2 for thermal stability. Excellent dimensional stability. Withstands 1,000 hours 85°C/85% RH. Serviceable from -100°F to +550°F. Tg 215-220°C.

Supreme 11AOHT Two Part Epoxy Supreme 11AOHT

Thermally conductive, electrically insulative epoxy adhesive. Meets MIL-STD-883J Section 3.5.2 for thermal stability. High peel and shear strength properties. Non-drip system. Resists -100°F to +400°F. Toughened system. Can withstand rigorous thermal cycling. Convenient one to one mix ratio by weight or volume. Cures at room temperature.

Supreme 12AOHT-LO One Part Epoxy System Supreme 12AOHT-LO

One component, heat cure system for bonding, sealing. High strength product. Service operating temperature range from 4K to +500°F (260°C). Resists aggressive thermal cycling and shock. Substantial thermal conductivity of 9-10 BTU in/ft2 hr °F. Smooth thixotropic paste. NASA low outgassing approved. Meets MIL-STD-883J Section 3.5.2 for thermal stability. Withstands 1,000 hours 85°C/85% RH.