Expanded Product List
Master Bond Product Search
181 products match
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EP46HT-2AO Black Thermally conductive/electrically insulative. Passes NASA low outgassing tests. Serviceable from -100°F to +500°F. Tg 200-210°C. Remarkable dimensional stability. Impressive mechanical strength properties. |
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EP48TC Ultra low thermal resistance properties. Can be applied in bond lines as thin as 10-15 microns. Low CTE. Low shrinkage upon cure. Passes NASA low outgassing testing. Serviceable from -100°F to +300°F. Exceptional dimensional stability. Withstands 1,000 hours 85°C/85% RH. |
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EP4EN-80 One component, low viscosity epoxy that offers thermal conductivity, electrical insulation and a filler material with ultra small particle sizes. This imparts high mechanical strength properties, outstanding dimensional stability and low shrinkage upon curing. |
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EP4G-80 Graphite filled epoxy that cures at 80°C. Good electrical and thermal conductivity. Passes NASA low outgassing certification. Can be used for bonding, sealing, coating. Service temperature range is -50°C to +175°C |
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EP4G-80Med Graphite filled epoxy that cures at 80°C. Good electrical and thermal conductivity. Passes ISO 10993-5 certification. Can be used for bonding, sealing, coating. Service temperature range is -50°C to +175°C |
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EP4TC-80 One component epoxy for bonding, sealing and small encapsulation applications. High thermal conductivity and electrical insulation properties. Paste consistency epoxy featuring ultra fine particles filler material that allows application in very thin sections. High compressive strength, tensile modulus and dimensional stability. Serviceable from -50°C to +175°C. |
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EP4UF-80 One component, low viscosity epoxy primarily for underfill applications. Not premixed and frozen, with unlimited working life at room temperature. Cures at elevated temperatures with a minimum of 80°C. The service temperature range is -50°C to +150°C. |
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EP51AN Rapid room temperature curing thermally conductive/electrically insulative adhesive. Fast gelling. Low CTE. Serviceable from 4K to +250°F. High bond strength. Superior heat dissipative properties. Dimensionally stable. Chemical resistant. |
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EP51AO Rapid curing epoxy adhesive/sealant. Excellent thermal conductivity/electrical insulative properties. Fast set up time. Convenient one to one mix ratio by weight or volume. Serviceable from 4K to +250°F. Resists water, oil, fuels and many solvents. Superior heat dissipation characteristics. |
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EP52TC Low thermal resistance properties. Can be applied in bond lines as thin as 10-15 microns. Low CTE. Low shrinkage upon cure. Serviceable from -100°F to +300°F. Exceptional dimensional stability. |