Master Bond Product Search

156 products match

EP112AO Two Part Epoxy EP112AO

Low viscosity potting, casting, encapsulation compound. Two component, solvent free, heat cure epoxy. Moderate viscosity. Good water and chemical resistance. Excellent thermal conductivity and electrical insulation properties. Long working life. Viscosity 50-200 cps. Service temperature range from -60°F to 500°F.

EP112FLAN-1 Two Part Epoxy EP112FLAN-1

Two component epoxy formulation well suited for potting and encapsulation. Exceptionally high thermal conductivity. High dielectric strength. Good toughness. Service temperature range from -60°F to 500°F. Dimensional stability. Advantageous flow properties.

EP112FLAO-1 Two Part Epoxy EP112FLAO-1

Toughened two component epoxy resin system. High thermal conductivity and electrical insulation characteristics. Outstanding dimensional stability. Low coefficient of expansion. Meets NASA low outgassing requirements. Operating service temperature range from -60 to +450°F.

EP121AO Two Part Epoxy EP121AO

Thermally conductive, electrically insulative. Long working life. Outstanding dimensional stability. Superb heat resistance. Low coefficient of thermal expansion. Passes NASA low outgassing tests. Very long open time. Ideally suited for potting applications. Serviceable from -60°F to +500°F. Medium viscosity.

EP17HT-100 One Part Epoxy Compound EP17HT-100

High performance one part epoxy. Good flow properties. Thermally conductive, electrically insulative. Service temperature range -100°F to +500°F. Can be cast in thicknesses up to 1/2 inch. High dimensional stability.

EP17HTDA-1 One Part Epoxy EP17HTDA-1

Single component heat curable epoxy epoxy adhesive/sealant. Non-drip system. Resists up to 650°F. Meets NASA low outgassing specifications. Meets MIL-STD-883J Section 3.5.2 for thermal stability. High lap shear, tensile and compressive strength. Tg of 230-240°C after post cure.

EP17HTDA-2 Black
EP17HTND-CCM One Part Epoxy EP17HTND-CCM

Single component heat curable epoxy epoxy adhesive/sealant. Non-drip system. Resists up to 650°F. Meets NASA low outgassing specifications. High lap shear, tensile and compressive strength. Tg of 230-240°C after post cure.

EP21AN Two Part Epoxy System EP21AN

Thermally conductive/electrically insulative epoxy. Two part system cures at ambient temperatures. Has convenient one to one mix ratio by weight or volume. Excellent heat transfer characteristics. High bond strength. Shore D hardness 85-90. Low coefficient of expansion. Serviceable from -60°F to +250°F.

EP21ANHT Two Part Epoxy Compound EP21ANHT

Thermally conductive, electrically insulative epoxy has a 1 to 1 mix ratio by weight or volume. High bond strength. Resists -60°F to 400°F. Low shrinkage. Outstanding dimensional stability. Superior heat dissipation properties. Thermal conductivity 22-24 BTU · in/ft2· hr /°F [3.173 - 3.4615 W/m · K]. Low coefficient of expansion. Gray color.

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