Expanded Product List
Master Bond Product Search
178 products match
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EP21TCHT-1 Two part, room temperature curable epoxy system with high thermal conductivity. Serviceable from cryogenic temperatures up to +400°F. Electrically isolating. Meets NASA low outgassing specifications. Halogen free. Paste consistency. Formulated to cure at ambient temperatures. Withstands 1,000 hours 85°C/85% RH. |
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EP21TDC-2AN Flexibilized. Thermally conductive/electrically insulative. Thermal conductivity 22-24 BTU· in/ft2 hr· ° F. Serviceable from 4K to +250°F. Superb impact resistance. Long working life. High peel strength. Elongatio >25%. |
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EP21TDC-2AO Flexible high performance adhesive, sealant, encapsulant. Excellent heat dissipative properties. High dielectric strength. Long working life. Low exotherm. Elongatio >25%. Bonds well to similar and dissimilar substrates. Serviceable from 4k to +250°F. |
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EP21TDC-2AOLV Flexible high performance adhesive, sealant, encapsulant. Excellent heat dissipative properties. High dielectric strength. Long working life. Low exotherm. Elongatio >25%. Low viscosity formulation bonds well to similar and dissimilar substrates. Serviceable from 4K to +250°F. |
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EP21TDC-2LO Highly flexibilized, thermally conductive/electrically insulative epoxy adhesive. High elongation. Exhibits superior shear and peel strength properties. Serviceable from 4K to 250°F. Withstands thermal cycling, thermal shock and mechanical shock. Passes NASA low outgassing test. Cures at room temperature or more quickly at elevated temperatures. |
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EP21TDC-2LOND Highly flexible epoxy paste adhesive. Outstanding peel strength. Elongatio >25%. Thermally conductive/electrically insulative. Low outgassing. |
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EP21TDCANHT Features exceptional thermal conductivity. High dielectric strength. Idea for joining dissimilar substrates. Serviceable from -100°F to +400°F. Superior durability. Will cure at room temperature. |
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EP21TDCAOHT Flexibilized two component epoxy offers thermal conductivity/electrical insulative properties. High peel/shear strength formulation. Paste viscosity. Will not drip on vertical surfaces. Bonds well to dissimilar substrates. Serviceable from -100°F to +350°F. |
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EP21TDCN Nickel conductive epoxy adhesive. Volume resistivity is 5-10 ohm-cm. 100% reactive. Superior toughness. One to one mix ratio by weight or volume. Smooth paste viscosity. Ambient temperature cures or fast elevated temperature cures. Service operating temperature range from -100°F to +275°F. High bond strength. |
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EP21TDCN-LO Two component nickel conductive epoxy featuring high peel strength, superior toughness and low volume resistivity. Withstands thermal cycling. Meets NASA low outgassing specifications. The service temperature range is -100°F to +275°F. |