Durable, two component epoxy for high performance bonding and sealing

Key Features

  • Convenient handling
  • Good electrical conductivity
  • Withstands thermal cycling
  • Bonds well to many substrates

Product Description

Master Bond EP21TDCN is a two component, nickel filled, electrically conductive, adhesive for high performance bonding and sealing. Both Part A and Part B have smooth paste consistencies. The mix ratio is a forgiving one to one by either weight or volume. It cures readily at room temperature in 3-4 days, or, alternatively, at 150-200°F for 2-3 hours. The optimum cure is overnight at room temperature, followed by 2-3 hours at 150-200°F. The volume resistivity of the cured system is 5-10 ohm-cm. It is 100% reactive and does not contain any diluents or solvents.

Considering that it is an electrically conductive adhesive, EP21TDCN has a reasonably good physical strength profile. It bonds well to metals, composites, ceramics and many plastics. Both Parts A and B are colored nickel. Most importantly, it is a toughened system, formulated to withstand relatively rigorous thermal cycling as well as mechanical vibration and shock. The service temperature range is -100°F to +275°F. It has good resistance to fuels, oils and water. EP21TDCN is particularly effective for grounding and shielding applications. It is a good fit for a number of applications involving the aerospace, electronic, automotive and specialty OEM industries, where modest conductivity for shielding and grounding along with reasonably good physical properties are desirable.

Product Advantages

  • Convenient mixing: one to one mix ratio by weight or volume
  • Cures at ambient or elevated temperatures
  • Good electrical and thermal conductivity, especially for grounding, shielding and static dissipation
  • Very good toughness; can hold up to thermal cycling
  • High bond strength to similar and dissimilar substrates
  • Contains no solvents or diluents

Product Citation

EP21TDCN was cited in a paper titled "Laser Pulses Characterization with Pyroelectric Sensors" by Lorenzo Capineri and Marina Mazzoni at the Dipartimento Elettronica e Telecomunicazioni and Università di Firenze Italy, respectively. For more information click here.

Industrial Certifications

Meets EU Directive 2015/863




EP21TDCN is available is various sizes and units to accommodate customer's needs.

Case Studies

Master Bond EP21TDCN was used by researchers at Università di Firenze, Italy, to create a rigid structure for sensor arrays by bonding PVDF film between two PCBs in their study of the laser pulse detection capabilities of pyroelectric sensors. For this application, the researchers required a conductive bonding compound able to form reliable electrical connections between the film’s gold pads and the PCB’s copper pads. A further requirement for the bonding compound related directly to the fabrication process.

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