Durable, two component epoxy for high performance bonding and sealing

Key Features

  • Convenient handling
  • Good electrical conductivity
  • Withstands thermal cycling
  • Bonds well to many substrates

Product Description

Master Bond EP21TDCN is a two component, nickel filled, electrically conductive, adhesive for high performance bonding and sealing. Both Part A and Part B have smooth paste consistencies. The mix ratio is a forgiving one to one by either weight or volume. It cures readily at room temperature in 3-4 days, or, alternatively, at 150-200°F for 2-3 hours. The optimum cure is overnight at room temperature, followed by 2-3 hours at 150-200°F. The volume resistivity of the cured system is 5-10 ohm-cm. It is 100% reactive and does not contain any diluents or solvents.

Considering that it is an electrically conductive adhesive, EP21TDCN has a reasonably good physical strength profile. It bonds well to metals, composites, ceramics and many plastics. Both Parts A and B are colored nickel. Most importantly, it is a toughened system, formulated to withstand relatively rigorous thermal cycling as well as mechanical vibration and shock. The service temperature range is -100°F to +275°F. It has good resistance to fuels, oils and water. EP21TDCN is particularly effective for grounding and shielding applications. It is a good fit for a number of applications involving the aerospace, electronic, automotive and specialty OEM industries, where modest conductivity for shielding and grounding along with reasonably good physical properties are desirable.

Product Advantages

  • Convenient mixing: one to one mix ratio by weight or volume
  • Cures at ambient or elevated temperatures
  • Good electrical and thermal conductivity, especially for grounding, shielding and static dissipation
  • Very good toughness; can hold up to thermal cycling
  • High bond strength to similar and dissimilar substrates
  • Contains no solvents or diluents

Product Citation

EP21TDCN was cited in a paper titled "Laser Pulses Characterization with Pyroelectric Sensors" by Lorenzo Capineri and Marina Mazzoni at the Dipartimento Elettronica e Telecomunicazioni and Università di Firenze Italy, respectively. For more information click here.

Industrial Certifications


Meets EU Directive 2015/863

Packaging


Jars

Pails

EP21TDCN is available is various sizes and units to accommodate customer's needs.

Case Studies

Master Bond EP21TDCN was used by researchers at Università di Firenze, Italy, to create a rigid structure for sensor arrays by bonding PVDF film between two PCBs in their study of the laser pulse detection capabilities of pyroelectric sensors. For this application, the researchers required a conductive bonding compound able to form reliable electrical connections between the film’s gold pads and the PCB’s copper pads. A further requirement for the bonding compound related directly to the fabrication process.

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