Expanded Product List
Master Bond Product Search
431 products match
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EP21TDC-4HT Toughened epoxy compound for high performance bonding, sealing, casting. Serviceable from -65°F to +400°F. Cures at ambient temperatures. Excellent electrical insulative characteristics. Compound flows readily. Bonds well to untreated rubbers such as neoprene, nitrile SBR and EPDM. Superior shear and peel strength properties. |
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EP21TDC-4ND Smooth paste epoxy adhesive. High flexibility. Elongatio >200%. Impressive resistance to mechanical vibration and shock. Outstanding adhesion to rubbers such as SBR, nitrile, neoprene. T-peel strength >30 pli. Serviceable from -100°F to +250°F. |
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EP21TDC-7 High peel strength, room temperature curing epoxy. Has an elongation over 300%. Low temperature serviceability. Adheres well t natural rubber, neoprene, nitrile, SBR without surface preparation. Serviceable from -100°F to +250°F. Excellent resistance to thermal shock. T-peel strength > 40 pli. Can cure underwater. |
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EP21TDCF-3NV Rapid, room temperature curing, toughened epoxy adhesive. 100% reactive system. High peel and shear strength properites. Superior thermal cycling capabilities. Thixotropic paste. Gap filling. Chemically resistant. Non-critical one to one mix ratio by weight or volume. Resistant to vibration and shock.Serviceable from -410°F to +250°F. |
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EP21TDCF1 High peel/shear strength epoxy adhesive. Short fixture time. Fast room temperature cures. Excellent toughness. Superior thermal cycling capabilities. Adheres well to similar/dissimilar substrates. Thixotropic paste. Gray color. Serviceable from -100°F to +250°F. |
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EP21TDCHT High strength, high temperature resistant, two part system with excellent bond strength and thermal cycling capabilities. Serviceable from -100°F to +350°F. Meets MIL-STD-883J Section 3.5.2 for thermal stability. Moderate viscosity. Superior toughness. Withstands vibration, impact, shock. Good dimensional stability. Convenient one to one mix ratio. Dependable electrical insulation properties. |
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EP21TDCHT-1 Flexibilized two component epoxy adhesive. Cures at room temperature or more rapidly at elevated temperatures. Forgiving one to one mix ratio. Ideal for bonding substrates with CTE mismatches. Superior chemical resistance. Durable. Service operating temperature range from -100°F to +400°F. |
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EP21TDCHT-LO Two component, toughened epoxy adhesive. High peel strength and shock resistant. NASA low outgassing certified. Convenient one to one mix ratio. Ideal for bonding similar and dissimilar substrates. Withstands 1,000 hours 85°C/85% RH. Serviceable from -100°F to +350°F. Good flow. Easy to apply. |
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EP21TDCHTND Epoxy paste adhesive. Non-drip system. Gap filling. Superior toughness. Withstands rigorous thermal cycling. Impressive bond strength. Serviceable from -100°F to +350°F. Convenient one to one mix ratio. Excellent electrical insulator. |
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EP21TP-2NV Two component polysulfide/epoxy adhesive/sealant. Cures at room or elevated temperature. Exceptional toughness and chemical resistance properties. Withstands exposure to fuels, oils, hydrocarbons and hydraulic fluids. Forgiving one to one mix ratio. Excellent electrical insulation properties. Serviceable from -80°F to +250°F. |