Expanded Product List
Master Bond Product Search
615 products match
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EP4G-80 Graphite filled epoxy that cures at 80°C. Good electrical and thermal conductivity. Passes NASA low outgassing certification. Can be used for bonding, sealing, coating. Service temperature range is -50°C to +175°C |
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EP4G-80Med Graphite filled epoxy that cures at 80°C. Good electrical and thermal conductivity. Passes ISO 10993-5 certification. Can be used for bonding, sealing, coating. Service temperature range is -50°C to +175°C |
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EP4NS-80 One component, silver filled epoxy for bonding, sealing and coating. It is low in viscosity and flows smoothly and easily. Not premixed and frozen and has a working life of 8-12 hours; it will not cure until heated. Cure schedule is simple and straightforward, 60 to 90 minutes at 80°C. |
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EP4S-80 One component, silver filled epoxy for bonding, sealing and coating. It is low in viscosity and flows smoothly and easily. Not premixed and frozen and has a working life of 8-12 hours; it will not cure until heated. Cure schedule is simple and straightforward, 60 to 90 minutes at 80°C. |
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EP4TC-80 One component epoxy for bonding, sealing and small encapsulation applications. High thermal conductivity and electrical insulation properties. Paste consistency epoxy featuring ultra fine particles filler material that allows application in very thin sections. High compressive strength, tensile modulus and dimensional stability. Serviceable from -50°C to +175°C. |
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EP4UF-80 One component, low viscosity epoxy primarily for underfill applications. Not premixed and frozen, with unlimited working life at room temperature. Cures at elevated temperatures with a minimum of 80°C. The service temperature range is -50°C to +150°C. |
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EP50-1.5 Rapid room temperature curing two component epoxy adhesive. Fixturing time of 5-8 minutes. Working life after mixing a 40 gram batch 2-3 minutes. One to one mix ratio by weight or volume. Solid tensile shear strength. Serviceable from 4K to +250°F. Available in different colors and viscosities. |
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EP51 "5" minute type system. Fast setting. Rapid curing at ambient temperature. Serviceable from 4K to +250°F. Adhesive/sealant. High strength bonds. Good chemical resistance. One to one mix ratio weight or volume. |
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EP51AN Rapid room temperature curing thermally conductive/electrically insulative adhesive. Fast gelling. Low CTE. Serviceable from 4K to +250°F. High bond strength. Superior heat dissipative properties. Dimensionally stable. Chemical resistant. |
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EP51AO Rapid curing epoxy adhesive/sealant. Excellent thermal conductivity/electrical insulative properties. Fast set up time. Convenient one to one mix ratio by weight or volume. Serviceable from 4K to +250°F. Resists water, oil, fuels and many solvents. Superior heat dissipation characteristics. |