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Product	Certifications	Applications	Viscosity	Cure Schedule	Hardness	Temp. Range	Link to Content
EP17HT One component epoxy system for bonding, sealing, coating and casting Glass Transition Temperature (Tg) 200-210°C Tensile Lap Shear Strength 2,600-2,800 psi at 75°F	RoHS Compliant	Bonding Sealing Coating Encapsulation	45,000-75,000 cps	Optimum cure schedule is 300°F for 4-6 hours, plus 12-24 hours at 350°F.	80-90 Shore D	-80°F to +600°F	/tds/ep17ht
EP17HT-100 One component epoxy system for potting, encapsulation, bonding and sealing applications with a curing temperature of 200-220°F or higher Dielectric Constant 3.5 Thermal Conductivity 0.58-0.72 W/(m·K)	RoHS Compliant	Bonding Sealing Encapsulation Potting Casting	40,000-70,000 cps	Cures in 60-90 minutes at 200-220°F, or 45-60 minutes at 275-300°F		-100°F to +500°F	/tds/ep17ht-100
EP17HT-3 One component, snap-curing epoxy system Glass Transition Temperature (Tg) 110-120°C Tensile Lap Shear Strength 1,800-2,000 psi	RoHS Compliant 1,000 Hours at 85°C/85% RH	Bonding Coating Sealing	80,000-130,000 cps	300°F for 8-12 minutes, 350°F for 3-5 minutes	80-90 Shore D	-60°F to +400°F	/tds/ep17ht-3
EP17HTDA-1 One component, high temperature resistant epoxy system for bonding and sealing Dielectric Constant 4.3 Glass Transition Temperature (Tg) 130-135°C	MIL-STD-883J for Thermal Stability NASA Low Outgassing RoHS Compliant	Bonding Sealing Die Attach	200,000-250,000 cps	12-15 minutes at 212°F or 5-6 minutes at 300°F, followed by 2-3 hours at 300°F or 1-2 hours at 350°F	85-95 Shore D	-80°F to +525°F	/tds/ep17htda-1
EP17HTDA-2 One component die attach epoxy system with exceptionally high glass transition temperature Dielectric Constant 4.4 Glass Transition Temperature (Tg) 185-190°C	NASA Low Outgassing RoHS Compliant	Bonding Sealing Die Attach	>1,000,000 cps	4-5 hours at 300°F or 3-4 hours at 350°F; to optimize properties, use an additional 2-3 hours at 400°F	90-95 Shore D	-80°F to +600°F	/tds/ep17htda-2
EP17HTDM-2 Black One component, black epoxy for bonding, sealing and specialty dam-and-fill applications Dielectric Constant 4.6 Glass Transition Temperature (Tg) 180-190°C	NASA Low Outgassing RoHS Compliant	Bonding Sealing	>800,000 cps	4-6 hours at 300°F, 2-3 hours at 350°F	90-95 Shore D	-80°F to +600°F	/tds/ep17htdm-2-black
EP17HTND-2 One component, high temperature resistant epoxy system for bonding, sealing and coating with a paste consistency Glass Transition Temperature (Tg) 200-210°C Tensile Lap Shear Strength 2,900-3,100 psi	NASA Low Outgassing RoHS Compliant	Bonding Sealing Gap Filling	paste	6-8 hours at 300°F followed by a post cure of 6-12 hours at 350°F	80-90 Shore D	-80°F to +600°F	/tds/ep17htnd-2
EP17HTND-CCM One component, high temperature resistant epoxy system for bonding and sealing Glass Transition Temperature (Tg) 160-165°C Tensile Lap Shear Strength 2,400-2,600 psi	NASA Low Outgassing RoHS Compliant	Bonding Sealing Encapsulation Coating	Paste	Typical curing schedules are 2 hours at 300°F or 1-2 hours at 350°F.	80-90 Shore D	-80°F to +550°F	/tds/ep17htnd-ccm
EP17HTS-DA One component, high temperature resistant, electrically conductive, die attach epoxy Glass Transition Temperature (Tg) 125-135°C Volume Resistivity <0.005 ohm-cm	MIL-STD-883J for Thermal Stability NASA Low Outgassing RoHS Compliant	Bonding Die Attach Sealing Coating Gap Filling	paste	1 hour at 180°F, followed by 2-3 hours at 300°F with a post cure of 1-2 hours at 350°F.	75-85 Shore D	-80°F to +550°F	/tds/ep17hts-da
EP17TF One component, toughened epoxy system for bonding, sealing and coating Elongation 5-10% Tensile Lap Shear Strength 8,000-9,000 psi	RoHS Compliant	Bonding Sealing Coating Encapsulation Gap Filling	paste	5-6 hours at 300°F followed by a post cure of 4-5 hours at 350°F	85-95 Shore D	-150°F to +550°F	/tds/ep17tf

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