Product Selector | MasterBond.com

Product	Certifications	Applications	Viscosity	Cure Schedule	Hardness	Temp. Range	Link to Content
EP21HT-LO Two component epoxy compound for high performance applications Tensile Lap Shear Strength 2,800-3,000 psi. Volume Resistivity >10¹⁴ ohm-cm.	NASA Low Outgassing RoHS Compliant 1,000 Hours at 85°C/85% RH	Bonding Sealing Coating	Part A: 60,000-110,000 cps., Part B: 11,000-15,000 cps.	75°F: 48-72 hours; 200°F: 2-3 hours; Optimum cure schedule: overnight at 75°F, followed by 2 hours at 150-200°F.	75-85. Shore D	-60°F to +400°F.	/tds/ep21ht-lo
EP21HTFG Two component epoxy compound for high performance applications Tensile Lap Shear Strength >3,000 psi. Volume Resistivity >10¹⁴ ohm-cm.	RoHS Compliant FDA Food Grade 21 CFR 175.105	Bonding Sealing Coating Gap Filling	Part A: 60,000-110,000 cps., Part B: 11,000-15,000 cps.	Cures within 48-72 hours at 75°F.	>75 Shore D	-60°F to +400°F.	/tds/ep21htfg
EP21HTND Two component epoxy compound for bonding, sealing and coating Dielectric Constant 2.90 Volume Resistivity >10¹⁴ ohm-cm	FDA Food Grade 21 CFR 175.105 RoHS Compliant	Bonding Sealing Coating	Part A: paste, Part B: paste	Cures readily at 75°F or faster at elevated temperatures with the optimum being overnight at 75°F followed by 1-2 hours at 150-200°F.	>75 Shore D	-60°F to +400°F	/tds/ep21htnd
EP21LSCL-2 Two component, optically clear epoxy for bonding, coating, sealing and potting featuring superior non-yellowing properties and temperature resistance Dielectric Strength 440 volts/mil Refractive Index 1.57	RoHS Compliant NASA Low Outgassing	Bonding Sealing Coating Potting Casting Gap Filling Encapsulation	Part A: 1,500 - 2,500 CPS, Part B: 5 - 50 CPS	overnight at 75°F followed by 3-5 hours at 140-175°F	80-90 Shore D	-60°F to +350°F	/tds/ep21lscl-2
EP21LSCL-2Med Two component, optically clear epoxy for bonding, coating, sealing and potting featuring superior non-yellowing properties Dielectric Strength 440 volts/mil Refractive Index 1.57	ISO 10993-5 for Cytotoxicity RoHS Compliant	Bonding Sealing Coating Potting Encapsulation Gap Filling Underfill	600-900 cps	overnight at 75°F followed by 3-5 hours at 140-175°F	80-90 Shore D	-60°F to +350°F	/tds/ep21lscl-2med
EP21LV Two component, low viscosity epoxy compound Dielectric Strength 440 volts/mil Tensile Lap Shear Strength >2,800 psi	FDA Food Grade 21 CFR 175.105 RoHS Compliant	Bonding Sealing Coating Casting Encapsulation	10,000-13,000 cps	75°F: 24-48 hours	>70 Shore D	-65°F to +250°F	/tds/ep21lv
EP21LV-LO Two component, low viscosity NASA low outgassing epoxy compound Dielectric Constant 2.79 Tensile Lap Shear Strength 2,600-2,800 psi	1,000 Hours at 85°C/85% RH RoHS Compliant NASA Low Outgassing	Bonding Sealing Coating Encapsulation Gap Filling Potting Casting	10,000-13,000 cps	overnight at 75°F followed by 2 hours at 150-200°F	70-80 Shore D	-65°F to +250°F	/tds/ep21lv-lo
EP21LV3/5Med Two part epoxy system for medical and related applications featuring superior toughness Dielectric Constant 3.15 Tensile Lap Shear Strength 1,000-1,200 psi	FDA Food Grade 21 CFR 175.105 RoHS Compliant USP Class VI Medical	Bonding Sealing Coating Encapsulation Gap Filling	10,000-14,000 cps	75°F: 2-3 days, 200°F: 3 hours	60-70 Shore D	-80°F to +250°F	/tds/ep21lv35med
EP21LVFL Two component, low viscosity epoxy for bonding, sealing, coating, and potting featuring good flexibility Elongation 120-150% Volume Resistivity >10¹⁵ ohm-cm	RoHS Compliant	Bonding Sealing Coating Encapsulation Gap Filling	10,000-14,000 cps	overnight at 75°F followed by 4-6 hours at 125-150°F	40-50 Shore D	-100°F to +250°F	/tds/ep21lvfl
EP21LVSP6 Two component epoxy for bonding, sealing, coating and encapsulating Dielectric Strength 450 volts/mil Volume Resistivity >10¹⁴ ohm-cm	RoHS Compliant MIL-STD-810G for Fungus Resistance	Bonding Sealing Coating Casting Encapsulation	Part A: 1,500-3,000 cps, Part B: 5,000-8,000 cps	75°F: 3-5 days; 200°F: 3-4 hours.	65-75 Shore D	-60°F to +250°F	/tds/ep21lvsp6

Need Expert Guidance?

Our expert engineers offer one-on-one consultations to help you navigate our extensive material library and find the right solution for your application. We ensure confidentiality and quick turnaround (1-2 business days).

Discuss Your Application