EP21TDCF-1

Master Bond Polymer System EP21TDCF1 is a two component epoxy adhesive for high performance bonding formulated to cure quickly at room temperature or more rapidly at elevated temperatures, with a onetoone non critical mix ratio, weight or volume. It readily develops a high bonding strength of more than 1700 psi at room temperature which, unlike that of many other epoxy adhesives, is relatively insensitive to mixing ratio or substrate cleaning procedures. The EP21TDCF1 epoxy resin system furthermore features very high peel strength after room temperature cure. It produces durable high strength and tough bonds and seals which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of 100°F to more than 250°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive is an electrical insulator. Color of part A gray, part B amber. Master Bond EP21TDCF1 is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries. A nondrip version, EP21TDCF1ND is also available as well as a faster curing version called EP21TDCF3.