EP3HT-LO Product Information

One Part Epoxy EP3HT-LO

One Component, Epoxy System for Bonding, Sealing and Coating Featuring Very Fast Cure along with High Strength Properties. Meets NASA low outgassing specifications.

EP21LSCL-2Med Product Information

Two Part Epoxy EP21LSCL-2Med

Two Component, Room Temperature Curing Epoxy Resin for Bonding, Coating, Sealing and Potting Offers Outstanding Non-Yellowing Characteristics; Featuring Low Viscosity. ISO 10993-5 for cytotoxicity.

Supreme 121AOMed Product Information

Two Part Epoxy Supreme 121AOMed

Two part toughened epoxy for bonding, sealing and encapsulation features good thermal conductivity

EP4NS-80 Product Description

One Part Epoxy System EP4NS-80

One component epoxy for bonding, sealing and coating applications, curing temperature 80°C. Electrically conductive, NASA low outgassing.

EP21ARHTND-2 Product Information

Two Part Epoxy EP21ARHTND-2

Two Component, Room Temperature Curable Epoxy Adhesive, Sealant, Coating System, Featuring Outstanding Chemical Resistance to Acids Along with Higher Temperature Resistance.

EP21LVTK-2 Product Information

Two Component, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing and Coating and Encapsulation Featuring Outstanding Physical Properties, Commanding Dimensional Stability, Low Shrinkage Upon Curing and Easy Processing.

Supreme 11AOHTMed Product Information

Master Bond Supreme 11AOHTMed Epoxy System

Two Component, Room Temperature Curing, Passes ISO 10993-5. Thermally Conductive, Electrically Isolating Epoxy for Bonding and Sealing Featuring High Temperature Resistance along with High Shear and Peel Strength.

EP30D-7SPHT Product Information

Flexibilized, Two Component, Room Temperature Curing, Urethane-Modified Epoxy System Featuring Superior Toughness, and Abrasion Resistance for High Performance Bonding, Sealing, Coating and Encapsulation

LED415DC90 Product Information

One Part Adhesive LED415DC90

One component, dual curing LED system with a specialty light penetration profile allowing for rapid fixturing and subsequent curing by heat

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