EP30AOHT Product Description

Master Bond Polymer System EP30AOHT is a two component epoxy resin system for high performance bonding, potting, sealing and coating, formulated to cure at room temperature or more rapidly at elevated temperatures. It has a ten to one (10:1) mix ratio by weight. EP30AOHT has an attractive balance of performance properties including high thermal conductivity, excellent electrical insulation characteristics and superior dimensional stability, as well as a good physical strength profile. The system has excellent flow properties making it ideal as a thermally conductive, electrically insulating potting epoxy. EP30AOHT is also a superb adhesive/sealant forming durable rigid bonds that are resistant to thermal cycling and chemicals including water, oil and most solvents, over the wide temperature range of -60°F to +400°F. The thermal expansion coefficient is exceptionally low: 22-25 ppm/°C. Color of Part A is off white, Part B is clear. Master Bond EP30AOHT is widely used in the electronic, electrical, computer and chemical industries where electrical insulation and environmental protection are required and heat transfer must be maintained.

Product Advantages

• Easy application: adhesive spreads or pours evenly and smoothly.
• Versatile cure schedules: ambient temperature cures or fast elevated temperature cures as required.
• High bond strength to a wide variety of substrates; excellent adhesive properties.
• High thermal conductivity with exceptional electrical insulation properties.
• Low thermal expansion coefficient; superior dimensional stability.
• Good physical strength characteristics; especially high compressive strength.
• Excellent flowability; suitable for potting and casting.
• Exceptionally high temperature resistance; serviceable to 400°F.