Low Viscosity, Flexibilized, Two Component Epoxy Compound for High Performance Potting, Casting, Encapsulation, Bonding and Sealing. Contains UV Blocking Agent & Wetting Agent

Master Bond Polymer System EP30FLSP is a low viscosity, flexibilized, two component epoxy resin system for high performance potting, casting, encapsulation as well as bonding and sealing. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight. This compound is 100% reactive and does not contain any solvents or other volatiles. It is especially recommended where low viscosity is required for ease of application, and where the pottings, castings and encapsulations must withstand mechanical shock, vibration or thermal cycling without cracking. Shrinkage after cure is exceptionally low.

Master Bond Polymer System EP30FLSP produces high strength and tough flexible castings, bonds and seals which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the temperature range of 4K to more than 250°F, making it suitable for cryogenic applications. Adhesion to both similar and dissimilar materials including metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened compound is an electrical insulator. Color of part A is clear, part B slightly yellow. Master Bond Polymer System EP30FLSP is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries.