Two component, room temperature curing epoxy for bonding, sealing, coating and encapsulating with low coefficient of thermal expansion

Key Features

  • Thermally and electrically insulating
  • Good flow properties
  • Low shrinkage upon cure
  • Superior dimensional stability

Product Description

Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE). It has a forgiving 100 to 5 mix ratio by weight and cures readily at room temperature or more quickly at elevated temperatures. To obtain optimum properties, a good cure schedule is overnight at room temperature followed by 2-4 hours at 150-200°F. The CTE is extremely low, 10-13 x 10-6 in/in/°C. Additionally, it is highly dimensionally stable and electrically insulative. Very significantly, this epoxy has low linear and volumetric shrinkage upon curing.

EP30LTE-2 bonds well to a wide variety of substrates including metals, glass, ceramics and many rubbers and plastics. It is 100% reactive and does not contain any solvents or diluents. This system offers excellent resistance to many chemicals, such as water, fuels and oils, as well as a number of acids and bases. It is serviceable over the wide temperature range of 4K to +250°F. Part A of this system is off white in color and Part B is clear. EP30LTE-2 is especially used in aerospace, optical, electronic, specialty OEM and other applications where low shrinkage, an ultra low CTE along with superb dimensional stability are important requirements.

Product Advantages

  • Relatively easy processing
  • 100% reactive
  • Good flow properties
  • Exceptionally high compressive strength
  • Cryogenically serviceable
  • Meets NASA low outgassing specifications

Industrial Certifications

ASTM E595 Compliant

Meets EU Directive 2015/863




Premixed & Frozen Syringe

EP30LTE-2 is available is various sizes and units to accommodate customer's needs.

Visual Media

Master Bond EP30LTE-2 has been developed for joining dissimilar substrates exposed to thermally or mechanically induced stresses.

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