Two Component, Room Temperature Curing Epoxy Adhesive Featuring Both High Shear and High Peel Strength For Optimal Bonding Performance

Master Bond Polymer System Supreme 11 represents a breakthrough in epoxy adhesive technology featuring a unique balance of performance properties including both high shear and high peel strengths. This two component adhesive system is formulated to cure at room temperature or more rapidly at elevated temperatures, with a convenient mix ratio of one to one. Master Bond Polymer Adhesive Supreme 11 is suitable for service in a wide temperature range of -100°F to over 300°F. It offers truly remarkable resistance to impact, thermal shock, vibration and stress fatigue cracking while maintaining the moisture, creep, corrosion and thermal resistance typical of epoxy resin adhesives. Master Bond Polymer Adhesive Supreme 11ND is a non-drip version of Supreme 11, it can be applied without sagging or dripping even on vertical surfaces. It is 100% reactive and does not contain any diluents or solvents.

Master Bond Polymer System Supreme 11 produces durable, high strength, exceptionally tough bonds which are remarkably resistant to severe thermal cycling, shock and vibration. It is also resistant to many chemicals including water, oil, fuels and some organic solvents. Tensile shear strengths in excess of 1600 psi and T-peel strengths of 25 pli are readily obtained. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive is a superior electrical insulator. Color of part A is gray, part B is tan. Supreme 11 offers the convenience of a temperature cure with a uniquely favorable performance profile for use in even the most difficult applications in the aerospace, electronic, electrical, computer, construction, appliance, automotive and chemical industries.