Two Component, Room Temperature Curing Epoxy Adhesive Featuring Both High Shear and High Peel Strength for Optimal Bonding Performance Up to 400°F.

Master Bond Supreme 11HT-4 represents a breakthrough in epoxy adhesive technology featuring a hitherto unattainable balance of performance properties including both high shear and high peel strengths as well as outstanding dimensional stability. This two component adhesive system is formulated to cure readily at room temperature or more rapidly at elevated temperatures, with a convenient mix ratio of 100:40 by weight. Supreme 11HT-4 produces exceptionally good performance bonds with high shear and high peel strengths for service over the wide temperature range of below -100°F to +400°F. It offers truly remarkable resistance to impact, thermal shock, vibration and stress fatigue cracking while maintaining the moisture, creep, corrosion and thermal resistance typical of epoxy resin adhesives. It is 100% reactive and does not contain any diluents or solvents. Aramid fiber reinforcement assures outstanding dimensional stability.

Supreme 11HT-4 produces durable, high strength, exceptionally tough bonds which are remarkably resistant to severe thermal cycling and many chemicals including water, oil, fuels and most organic solvents even upon prolonged exposures. Tensile shear strengths in excess of 1,600 psi and T-peel strengths of 25 pli are readily obtained. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive is a superior electrical insulator. Color of Part A is gray, Part B is amber. Supreme 11HT-4 offers the convenience of a room temperature cure with a uniquely favorable performance for use in even the most difficult applications in the aerospace, electronic, electrical, computer, construction, appliance, automotive and chemical industries for up to 400°F service.

Product Advantages

  • Convenient mixing; non-critical ratio 100:40 by weight.
  • Surface cleanliness not critical for good bonding in many cases but recommended for optimum strength.
  • Easy application; contact pressure only required for cure; adhesive spreads evenly and smoothly; no-drip application feature.
  • Versatile cure schedules; ambient temperature cure or faster elevated temperature cures as required.
  • High shear and peel bonding strength to similar and dissimilar substrates over the remarkably wide temperature range of below -100°F to +400°F.
  • Good electrical insulating properties and chemical resistance.
  • Superior thermal shock, impact and stress cracking fatigue resistance.
  • Excellent long-term durability and dimensional stability.